Plating onto plastics can be advantageous, but it requires specialized plating techniques and careful attention to detail. With the right approach, you can plate metals such as gold, nickel and copper onto plastics such as acrylonitrile butadiene styrene (ABS), Teflon, polycarbonate, polysulfone, phenolic and polyoxymethylene (Polyacetal). In previous columns related to the electroless nickel-immersion gold process, Michael Carano focused on plating and process defects related to mostly pre-plate process steps such as poor or inadequate cleaning, micro-etching and rinsing. The failure caused by poor plating or by misunderstanding your project's application can be a mere inconvenience or it could be catastrophic - a total system failure causing loss of life. Simply put, the plating and tinning company you choose has the power to make or break your project. The contamination of plating solutions, including dissolution of the solder resist (SR), side reaction products, and impurities (Cu, Ni, drag-in), can be a cause of the black pad phenomenon. Defects, such as a black pads and pinholes, are generated on the Ni/Au interface after the electroless nickel immersion gold (ENIG) process. The copper coating is an important component of […] Gold (Au) plating peels off of nickel plating. When things don’t go as expected, we have to take a step back and examine every aspect of the plating process to eliminate any number of variables. These are the least probable causes of defects especially if extremely common plating baths are used like, for example, those for gold and rhodium plating. [clarification needed after first charge showing locally high utilization (gold color) caused by the defect and no observable plating, (d) discharged defect-containing cell after cycling showing local plating in a ring shape around the defect. The colors of the photographs have been enhanced to emphasize the spatial color variations. Common Electroplating Problems… Plating is a very precise science, working with metals on the molecular level, and for the companies that we work with, absolute perfection is a necessity. The defect percentage is about 1 out of 25. The base substrate is Cu and then Ni and finally Au. The Ni layer is very thin, just as a barrier for Cu diffusion. Know your process and requirements for durable, high conductivity, corrosion resistant plating. This month, he tackles additional annoyances that lead to scrap and reduce the confidence in the ENIG process. A discussion started in but continuing through 2018. Electroplated copper is the most widely used preplating layer for improving the bond strength of the coating. 2000. We also mechanically agitate our gold plating solution to improve coating smoothness and to prevent streaking and other defects. Q. I have faced Au peeling problem. 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